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JJS Highlights Significance of Baking Prior to flex Circuit Assembly
Britain-based JJS Manufacturing is an EMS enterprise which specializes in end-to-end procurement, manufacturing (Circuit Board assembly, box build, cabinet, electro-mechanical) and supply chain solutions. The enterprise supplies complex, very configurable, low-to-medium-volume industrial electronics products across a range of markets for instance, industrial automation, process control, test and measurement, and laboratory technology.
Editor Stephen Las Marias chatted with Russell Poppe, manager of technology, on the concerns of addressing flex circuit assemblies and provides approaches to tackle them.
Stephen Las Marias: From your experience, what are the principal challenges in flex circuit assembly?
Russell Poppe: From an assembly point of view, baking the flex circuits prior to manufacturing assembly is important as they can be prone to delamination. That said, baking any Circuit Board prior to manufacturing is best practice and something we consistently perform at JJS.
One of the largest challenges in flex circuit assembly is to ensure the circuits keep flat, specially during the printing and pick-and-place operations. The components of the circuit which require SMT placement ought to have an FR-4 stiffener designed in underneath; nevertheless, it’s equally important to work with the Circuit Board supplier beforehand. Getting the panelization right is important so that the boards don’t bend when the components are placed or when they move across reflow. Panel design generally is a difficult task as flex circuits are often times unusual shapes! It might also be important to have a customized carrier or pallet to hold the flex circuits in place throughout the process; even so, these carry additional costs-generally several hundred pounds each.
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